3-Dimensional Integration with High Interconnection Density

Rino Choi, Ye-Eun Hong, Anh Duy Nguyen. 3-Dimensional Integration with High Interconnection Density. In International Conference on IC Design and Technology, ICICDT 2022, Hanoi, Vietnam, September 21-23, 2022. pages 77-80, IEEE, 2022. [doi]

Authors

Rino Choi

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Ye-Eun Hong

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Anh Duy Nguyen

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