Rino Choi, Ye-Eun Hong, Anh Duy Nguyen. 3-Dimensional Integration with High Interconnection Density. In International Conference on IC Design and Technology, ICICDT 2022, Hanoi, Vietnam, September 21-23, 2022. pages 77-80, IEEE, 2022. [doi]
@inproceedings{ChoiHN22,
title = {3-Dimensional Integration with High Interconnection Density},
author = {Rino Choi and Ye-Eun Hong and Anh Duy Nguyen},
year = {2022},
doi = {10.1109/ICICDT56182.2022.9933124},
url = {https://doi.org/10.1109/ICICDT56182.2022.9933124},
researchr = {https://researchr.org/publication/ChoiHN22},
cites = {0},
citedby = {0},
pages = {77-80},
booktitle = {International Conference on IC Design and Technology, ICICDT 2022, Hanoi, Vietnam, September 21-23, 2022},
publisher = {IEEE},
isbn = {978-1-6654-5901-3},
}