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Drop impact reliability testing for lead-free and lead-based soldered IC packages

Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low. Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectronics Reliability, 46(7):1160-1171, 2006. [doi]

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Desmond Y. R. Chong

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F. X. Che

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John H. L. Pang

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Kellin Ng

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Jane Y. N. Tan

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Patrick T. H. Low

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