Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low. Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectronics Reliability, 46(7):1160-1171, 2006. [doi]
@article{ChongCPNTL06,
title = {Drop impact reliability testing for lead-free and lead-based soldered IC packages},
author = {Desmond Y. R. Chong and F. X. Che and John H. L. Pang and Kellin Ng and Jane Y. N. Tan and Patrick T. H. Low},
year = {2006},
doi = {10.1016/j.microrel.2005.10.011},
url = {http://dx.doi.org/10.1016/j.microrel.2005.10.011},
tags = {rule-based, testing, reliability},
researchr = {https://researchr.org/publication/ChongCPNTL06},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {46},
number = {7},
pages = {1160-1171},
}