A Test Integration Methodology for 3D Integrated Circuits

Che-Wei Chou, Jin-Fu Li, Ji-Jan Chen, Ding-Ming Kwai, Yung-Fa Chou, Cheng-Wen Wu. A Test Integration Methodology for 3D Integrated Circuits. In Proceedings of the 19th IEEE Asian Test Symposium, ATS 2010, 1-4 December 2010, Shanghai, China. pages 377-382, IEEE Computer Society, 2010. [doi]

Abstract

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