Stephone Christian, Blayne Montaque, Saurav K. Aryal. Time-Aware Two-Dimensional Packing for Slicing-Aware 3D Printing Throughput Optimization. In Ron P. A. Petrick, Christopher W. Geib, editors, Proceedings of the 2026 AAAI Spring Symposium Series, Burlingame, California, USA, April 7-9, 2026. pages 32-39, AAAI Press, 2026. [doi]
Abstract is missing.