3Sn formation on the mechanical reliability of Ni/Sn solder joints

Kunmo Chu, Changseung Lee, Sung-Hoon Park, Yoonchul Sohn. 3Sn formation on the mechanical reliability of Ni/Sn solder joints. Microelectronics Reliability, 75:53-58, 2017. [doi]

Abstract

Abstract is missing.