Nonrectangular shaping and sizing of soft modules for floorplan-design improvement

Chris C. N. Chu, Evangeline F. Y. Young. Nonrectangular shaping and sizing of soft modules for floorplan-design improvement. IEEE Trans. on CAD of Integrated Circuits and Systems, 23(1):71-79, 2004. [doi]

@article{ChuY04,
  title = {Nonrectangular shaping and sizing of soft modules for floorplan-design improvement},
  author = {Chris C. N. Chu and Evangeline F. Y. Young},
  year = {2004},
  doi = {10.1109/TCAD.2003.819896},
  url = {http://doi.ieeecomputersociety.org/10.1109/TCAD.2003.819896},
  tags = {C++, design},
  researchr = {https://researchr.org/publication/ChuY04},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
  volume = {23},
  number = {1},
  pages = {71-79},
}