Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2 - researchr publication authors

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Ho-Chiao Chuang, Wei-Hong Lai, Chih-Chung Huang, Ai-Ho Liao, Chih-Kuang Yeh. Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2. In 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2014, Waikiki Beach, HI, USA, April 13-16, 2014. pages 108-112, IEEE, 2014. [doi]

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