Ho-Chiao Chuang, Wei-Hong Lai, Chih-Chung Huang, Ai-Ho Liao, Chih-Kuang Yeh. Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2. In 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2014, Waikiki Beach, HI, USA, April 13-16, 2014. pages 108-112, IEEE, 2014. [doi]
@inproceedings{ChuangLHLY14,
title = {Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2},
author = {Ho-Chiao Chuang and Wei-Hong Lai and Chih-Chung Huang and Ai-Ho Liao and Chih-Kuang Yeh},
year = {2014},
doi = {10.1109/NEMS.2014.6908770},
url = {https://doi.org/10.1109/NEMS.2014.6908770},
researchr = {https://researchr.org/publication/ChuangLHLY14},
cites = {0},
citedby = {0},
pages = {108-112},
booktitle = {9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2014, Waikiki Beach, HI, USA, April 13-16, 2014},
publisher = {IEEE},
isbn = {978-1-4799-4726-3},
}