Chun-Chih Chuang, Tsung-Fu Yang, Jin-Ye Juang, Yin-Po Hung, Chau-Jie Zhan, Yu-Min Lin, Ching-Tsung Lin, Pei-Chen Chang, Tao-Chih Chang. Influence of underfill materials on the reliability of coreless flip chip package. Microelectronics Reliability, 48(11-12):1875-1881, 2008. [doi]
Abstract is missing.