Norio Chujo, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba. Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]
@inproceedings{ChujoSSRNO23,
title = {Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy},
author = {Norio Chujo and Koji Sakui and Shinji Sugatani and Hiroyuki Ryoson and Tomoji Nakamura and Takayuki Ohba},
year = {2023},
doi = {10.23919/VLSITechnologyandCir57934.2023.10185277},
url = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185277},
researchr = {https://researchr.org/publication/ChujoSSRNO23},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023},
publisher = {IEEE},
isbn = {978-4-86348-806-9},
}