Sungjun Chun, Wiren Dale Becker, Jon Casey, Steve Ostrander, Daniel Dreps, Jose Ale Hejase, Ryan Nett, Brian Beaman, Jason R. Eagle. IBM POWER9 package technology and design. IBM Journal of Research and Development, 62(4/5):12, 2018. [doi]
@article{ChunBCODHNBE18,
title = {IBM POWER9 package technology and design},
author = {Sungjun Chun and Wiren Dale Becker and Jon Casey and Steve Ostrander and Daniel Dreps and Jose Ale Hejase and Ryan Nett and Brian Beaman and Jason R. Eagle},
year = {2018},
url = {http://ieeexplore.ieee.org/document/8392682/},
researchr = {https://researchr.org/publication/ChunBCODHNBE18},
cites = {0},
citedby = {0},
journal = {IBM Journal of Research and Development},
volume = {62},
number = {4/5},
pages = {12},
}