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Léa Di Cioccio, Rachid Taibi, C. Chappaz, S. Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix. 200°C direct bonding copper interconnects : Electrical results and reliability. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

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