Léa Di Cioccio, Rachid Taibi, C. Chappaz, S. Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix. 200°C direct bonding copper interconnects : Electrical results and reliability. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]
@inproceedings{CioccioTCMCS11,
title = {200°C direct bonding copper interconnects : Electrical results and reliability},
author = {Léa Di Cioccio and Rachid Taibi and C. Chappaz and S. Moreau and Laurent-Luc Chapelon and Thomas Signamarcheix},
year = {2011},
doi = {10.1109/3DIC.2012.6262976},
url = {http://dx.doi.org/10.1109/3DIC.2012.6262976},
researchr = {https://researchr.org/publication/CioccioTCMCS11},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}