Carlo Cognetti. The impact of semiconductor packaging technologies on system integration an overview. In 35th European Solid-State Circuits Conference, ESSCIRC 2009, Athens, Greece, 14-18 September 2009. pages 23-27, IEEE, 2009. [doi]
@inproceedings{Cognetti09,
title = {The impact of semiconductor packaging technologies on system integration an overview},
author = {Carlo Cognetti},
year = {2009},
doi = {10.1109/ESSCIRC.2009.5325925},
url = {https://doi.org/10.1109/ESSCIRC.2009.5325925},
researchr = {https://researchr.org/publication/Cognetti09},
cites = {0},
citedby = {0},
pages = {23-27},
booktitle = {35th European Solid-State Circuits Conference, ESSCIRC 2009, Athens, Greece, 14-18 September 2009},
publisher = {IEEE},
isbn = {978-1-4244-4354-3},
}