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Hardware-in-the-Loop Evaluation of Grid-Edge DER Chip Integration Into Next-Generation Smart Meters

Joshua Comden, Jing Wang, Subhankar Ganguly, Steven Forsyth, Reynaldo Gomez, Andrey Bernstein. Hardware-in-the-Loop Evaluation of Grid-Edge DER Chip Integration Into Next-Generation Smart Meters. In IEEE International Conference on Communications, Control, and Computing Technologies for Smart Grids, SmartGridComm IEEE, Glasgow, United Kingdom, October 31 - November 3, 2023. pages 1-6, IEEE, 2023. [doi]

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