Jason Cong, Lei He, Cheng-Kok Koh, David Zhigang Pan. Interconnect sizing and spacing with consideration of couplingcapacitance. IEEE Trans. on CAD of Integrated Circuits and Systems, 20(9):1164-1169, 2001. [doi]
@article{CongHKP01,
title = {Interconnect sizing and spacing with consideration of couplingcapacitance},
author = {Jason Cong and Lei He and Cheng-Kok Koh and David Zhigang Pan},
year = {2001},
doi = {10.1109/43.945311},
url = {http://doi.ieeecomputersociety.org/10.1109/43.945311},
researchr = {https://researchr.org/publication/CongHKP01},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {20},
number = {9},
pages = {1164-1169},
}