Jason Cong, Lei He, Cheng-Kok Koh, David Zhigang Pan. Global interconnect sizing and spacing with consideration of coupling capacitance. In ICCAD. pages 628-633, 1997. [doi]
@inproceedings{CongHKP97,
title = {Global interconnect sizing and spacing with consideration of coupling capacitance},
author = {Jason Cong and Lei He and Cheng-Kok Koh and David Zhigang Pan},
year = {1997},
doi = {10.1145/266388.266566},
url = {http://doi.acm.org/10.1145/266388.266566},
researchr = {https://researchr.org/publication/CongHKP97},
cites = {0},
citedby = {0},
pages = {628-633},
booktitle = {ICCAD},
}