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High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC

G. Coquery, G. Lefranc, T. Licht, R. Lallemand, N. Seliger, H. Berg. High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC. Microelectronics Reliability, 43(9-11):1871-1876, 2003. [doi]

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G. Coquery

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G. Lefranc

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T. Licht

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R. Lallemand

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N. Seliger

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H. Berg

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