G. Coquery, G. Lefranc, T. Licht, R. Lallemand, N. Seliger, H. Berg. High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC. Microelectronics Reliability, 43(9-11):1871-1876, 2003. [doi]
@article{CoqueryLLLSB03,
title = {High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC},
author = {G. Coquery and G. Lefranc and T. Licht and R. Lallemand and N. Seliger and H. Berg},
year = {2003},
doi = {10.1016/S0026-2714(03)00318-4},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00318-4},
tags = {testing, reliability},
researchr = {https://researchr.org/publication/CoqueryLLLSB03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {9-11},
pages = {1871-1876},
}