Design, characterization and signal integrity analysis of a 2.5 Gb/s High-Speed Serial Interface for automotive applications overarching the chip/PCB wall

Andrea Cossettini, A. Cristofoli, Werner Grollitsch, L. Alves, Roberto Nonis, L. Della Ricca, Pierpaolo Palestri, Luca Selmi. Design, characterization and signal integrity analysis of a 2.5 Gb/s High-Speed Serial Interface for automotive applications overarching the chip/PCB wall. In 1st IEEE International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow, RTSI 2015, Torino, Italy, September 16-18, 2015. pages 34-38, IEEE, 2015. [doi]

Abstract

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