Numerical analysis and experimental tests for solder joints power cycling optimization

Paolo Cova, Nicola Delmonte, D. Chiozzi. Numerical analysis and experimental tests for solder joints power cycling optimization. Microelectronics Reliability, 55(9-10):2036-2040, 2015. [doi]

Authors

Paolo Cova

This author has not been identified. Look up 'Paolo Cova' in Google

Nicola Delmonte

This author has not been identified. Look up 'Nicola Delmonte' in Google

D. Chiozzi

This author has not been identified. Look up 'D. Chiozzi' in Google