Paolo Cova, Nicola Delmonte, D. Chiozzi. Numerical analysis and experimental tests for solder joints power cycling optimization. Microelectronics Reliability, 55(9-10):2036-2040, 2015. [doi]
@article{CovaDC15, title = {Numerical analysis and experimental tests for solder joints power cycling optimization}, author = {Paolo Cova and Nicola Delmonte and D. Chiozzi}, year = {2015}, doi = {10.1016/j.microrel.2015.06.020}, url = {http://dx.doi.org/10.1016/j.microrel.2015.06.020}, researchr = {https://researchr.org/publication/CovaDC15}, cites = {0}, citedby = {0}, journal = {Microelectronics Reliability}, volume = {55}, number = {9-10}, pages = {2036-2040}, }