Brian Crites, Karen Kong, Philip Brisk. Reducing Microfluidic Very Large Scale Integration (mVLSI) Chip Area by Seam Carving. In Laleh Behjat, Jie Han, Miroslav N. Velev, Deming Chen, editors, Proceedings of the on Great Lakes Symposium on VLSI 2017, Banff, AB, Canada, May 10-12, 2017. pages 459-462, ACM, 2017. [doi]
@inproceedings{CritesKB17,
title = {Reducing Microfluidic Very Large Scale Integration (mVLSI) Chip Area by Seam Carving},
author = {Brian Crites and Karen Kong and Philip Brisk},
year = {2017},
doi = {10.1145/3060403.3060461},
url = {http://doi.acm.org/10.1145/3060403.3060461},
researchr = {https://researchr.org/publication/CritesKB17},
cites = {0},
citedby = {0},
pages = {459-462},
booktitle = {Proceedings of the on Great Lakes Symposium on VLSI 2017, Banff, AB, Canada, May 10-12, 2017},
editor = {Laleh Behjat and Jie Han and Miroslav N. Velev and Deming Chen},
publisher = {ACM},
isbn = {978-1-4503-4972-7},
}