Joseph Romen Cubillo, Roshan Weerasekera, Zaw Zaw Oo, En-Xiao Liu, Bob Conn, Surya Bhattacharya, Robert Patti. Interconnect design and analysis for Through Silicon Interposers (TSIs). In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-6, IEEE, 2011. [doi]
@inproceedings{CubilloWOLCBP11,
title = {Interconnect design and analysis for Through Silicon Interposers (TSIs)},
author = {Joseph Romen Cubillo and Roshan Weerasekera and Zaw Zaw Oo and En-Xiao Liu and Bob Conn and Surya Bhattacharya and Robert Patti},
year = {2011},
doi = {10.1109/3DIC.2012.6263039},
url = {http://dx.doi.org/10.1109/3DIC.2012.6263039},
researchr = {https://researchr.org/publication/CubilloWOLCBP11},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}