Interconnect design and analysis for Through Silicon Interposers (TSIs) - researchr publication related

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Joseph Romen Cubillo, Roshan Weerasekera, Zaw Zaw Oo, En-Xiao Liu, Bob Conn, Surya Bhattacharya, Robert Patti. Interconnect design and analysis for Through Silicon Interposers (TSIs). In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-6, IEEE, 2011. [doi]

The following publications are possibly variants of this publication:

Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI)Guruprasad Katti, S. W. Ho, Li Hong Yu, Songbai Zhang, Rahul Dutta, Roshan Weerasekera, Ka-Fai Chang, Jong-Kai Lin, Srinivasa Rao Vempati, Surya Bhattacharya. dt, 32(4):23-31, 2015. [doi]

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