David Cuesta, José L. Risco-Martín, José L. Ayala, José Ignacio Hidalgo. Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization. Appl. Soft Comput., 34:164-177, 2015. [doi]
@article{CuestaRAH15,
title = {Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization},
author = {David Cuesta and José L. Risco-Martín and José L. Ayala and José Ignacio Hidalgo},
year = {2015},
doi = {10.1016/j.asoc.2015.04.052},
url = {http://dx.doi.org/10.1016/j.asoc.2015.04.052},
researchr = {https://researchr.org/publication/CuestaRAH15},
cites = {0},
citedby = {0},
journal = {Appl. Soft Comput.},
volume = {34},
pages = {164-177},
}