Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization

David Cuesta, José L. Risco-Martín, José L. Ayala, José Ignacio Hidalgo. Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization. Appl. Soft Comput., 34:164-177, 2015. [doi]

Abstract

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