Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, Dao-Guo Yang. A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Microelectronics Reliability, 55(9-10):1877-1881, 2015. [doi]
@article{CuiCLZCY15,
title = {A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds},
author = {Zaifu Cui and Miao Cai and Ruifeng Li and Ping Zhang and Xianping Chen and Dao-Guo Yang},
year = {2015},
doi = {10.1016/j.microrel.2015.06.112},
url = {http://dx.doi.org/10.1016/j.microrel.2015.06.112},
researchr = {https://researchr.org/publication/CuiCLZCY15},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {55},
number = {9-10},
pages = {1877-1881},
}