Yingnan Cui, Wei Zhang, Vivek Chaturvedi, Weichen Liu, Bingsheng He. Thermal-aware task scheduling for 3D-network-on-chip: A Bottom-to-Top scheme. In 2014 International Symposium on Integrated Circuits (ISIC), Singapore, December 10-12, 2014. pages 224-227, IEEE, 2014. [doi]
Abstract is missing.