Development of a "Thermal-Associated Pain Index" score using infrared-thermography for objective pain assessment

M. Czaplik, N. Hochhausen, H. Dohmeier, C. Barbosa Pereira, R. Rossaint. Development of a "Thermal-Associated Pain Index" score using infrared-thermography for objective pain assessment. In 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Jeju Island, South Korea, July 11-15, 2017. pages 3831-3834, IEEE, 2017. [doi]

Abstract

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