Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions

B. Czerny, M. Lederer, B. Nagl, A. Trnka, G. Khatibi, M. Thoben. Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. Microelectronics Reliability, 52(9-10):2353-2357, 2012. [doi]

Abstract

Abstract is missing.