Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation

David Dalleau, Kirsten Weide-Zaage. Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation. Microelectronics Reliability, 41(9-10):1625-1630, 2001. [doi]

Abstract

Abstract is missing.