P. Dandu, X. J. Fan, Y. Liu, C. Diao. Finite element modeling on electromigration of solder joints in wafer level packages. Microelectronics Reliability, 50(4):547-555, 2010. [doi]
@article{DanduFLD10,
title = {Finite element modeling on electromigration of solder joints in wafer level packages},
author = {P. Dandu and X. J. Fan and Y. Liu and C. Diao},
year = {2010},
doi = {10.1016/j.microrel.2009.12.003},
url = {http://dx.doi.org/10.1016/j.microrel.2009.12.003},
tags = {modeling, C++},
researchr = {https://researchr.org/publication/DanduFLD10},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {50},
number = {4},
pages = {547-555},
}