Researchr is a web site for finding, collecting, sharing, and reviewing scientific publications, for researchers by researchers.
Sign up for an account to create a profile with publication list, tag and review your related work, and share bibliographies with your co-authors.
P. Dandu, X. J. Fan, Y. Liu, C. Diao. Finite element modeling on electromigration of solder joints in wafer level packages. Microelectronics Reliability, 50(4):547-555, 2010. [doi]
Abstract is missing.