Masoud Daneshtalab, Masoumeh Ebrahimi, Juha Plosila. HIBS - Novel inter-layer bus structure for stacked architectures. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-7, IEEE, 2011. [doi]
Abstract is missing.