2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults

Khanh N. Dang, Michael Conrad Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran. 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. In 2019 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2019, Bangkok, Thailand, November 11-14, 2019. pages 109-112, IEEE, 2019. [doi]

@inproceedings{DangMAAT19,
  title = {2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults},
  author = {Khanh N. Dang and Michael Conrad Meyer and Akram Ben Ahmed and Abderazek Ben Abdallah and Xuan-Tu Tran},
  year = {2019},
  doi = {10.1109/APCCAS47518.2019.8953131},
  url = {https://doi.org/10.1109/APCCAS47518.2019.8953131},
  researchr = {https://researchr.org/publication/DangMAAT19},
  cites = {0},
  citedby = {0},
  pages = {109-112},
  booktitle = {2019 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2019, Bangkok, Thailand, November 11-14, 2019},
  publisher = {IEEE},
  isbn = {978-1-7281-2940-2},
}