Sourav Das, Fei Su, Sreejit Chakravarty. Testing of Prebond Through Silicon Vias. IEEE Design & Test of Computers, 37(4):27-34, 2020. [doi]
@article{DasSC20-0,
title = {Testing of Prebond Through Silicon Vias},
author = {Sourav Das and Fei Su and Sreejit Chakravarty},
year = {2020},
doi = {10.1109/MDAT.2020.2968255},
url = {https://doi.org/10.1109/MDAT.2020.2968255},
researchr = {https://researchr.org/publication/DasSC20-0},
cites = {0},
citedby = {0},
journal = {IEEE Design & Test of Computers},
volume = {37},
number = {4},
pages = {27-34},
}