Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects - researchr publication authors

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Jacob Dawes, Tzu-Hsuan Chou, Matthew L. Johnston. Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects. In IEEE Biomedical Circuits and Systems Conference, BioCAS 2023, Toronto, ON, Canada, October 19-21, 2023. pages 1-5, IEEE, 2023. [doi]

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