Jacob Dawes, Tzu-Hsuan Chou, Matthew L. Johnston. Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects. In IEEE Biomedical Circuits and Systems Conference, BioCAS 2023, Toronto, ON, Canada, October 19-21, 2023. pages 1-5, IEEE, 2023. [doi]
@inproceedings{DawesCJ23,
title = {Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects},
author = {Jacob Dawes and Tzu-Hsuan Chou and Matthew L. Johnston},
year = {2023},
doi = {10.1109/BioCAS58349.2023.10388923},
url = {https://doi.org/10.1109/BioCAS58349.2023.10388923},
researchr = {https://researchr.org/publication/DawesCJ23},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {IEEE Biomedical Circuits and Systems Conference, BioCAS 2023, Toronto, ON, Canada, October 19-21, 2023},
publisher = {IEEE},
isbn = {979-8-3503-0026-0},
}