Microfluidic Lab-on-CMOS Packaging Using Wafer-Level Molding and 3D-Printed Interconnects

Jacob Dawes, Tzu-Hsuan Chou, Boyu Shen, Matthew L. Johnston. Microfluidic Lab-on-CMOS Packaging Using Wafer-Level Molding and 3D-Printed Interconnects. IEEE Trans. Biomed. Circuits and Systems, 18(4):821-833, August 2024. [doi]

Abstract

Abstract is missing.