Integration of Thermal Inkjet into Over-Molded Substrates for Lab-on-CMOS Pumping Applications - researchr publication authors

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Jacob Dawes, Alyssa Estenson, Louis Marun, George Corrigan, Alexander Govyadinov, Anand Jebakumar, Pavel Kornilovich, Erik Torniainen, Matthew L. Johnston. Integration of Thermal Inkjet into Over-Molded Substrates for Lab-on-CMOS Pumping Applications. In IEEE International Symposium on Circuits and Systems, ISCAS 2025, London, United Kingdom, May 25-28, 2025. pages 1-5, IEEE, 2025. [doi]

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