Libao Deng, Ning Sun, Ning Fu, Liyan Qiao. A TDR-Based Method for Pre-bond Testing of the Silicon Interposer in 2.5D ICs. In IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2019, Auckland, New Zealand, May 20-23, 2019. pages 1-6, IEEE, 2019. [doi]
Abstract is missing.