Modeling and Design of Chip-Package Interface

Anirudh Devgan, Luca Daniel, Byron Krauter, Lei He. Modeling and Design of Chip-Package Interface. In 6th International Symposium on Quality of Electronic Design (ISQED 2005), 21-23 March 2005, San Jose, CA, USA. pages 6, IEEE Computer Society, 2005. [doi]

Abstract

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