COUNTERFOIL: Verifying Provenance of Integrated Circuits using Intrinsic Package Fingerprints and Inexpensive Cameras - researchr publication authors

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Siva Nishok Dhanuskodi, Xiang Li, Daniel E. Holcomb. COUNTERFOIL: Verifying Provenance of Integrated Circuits using Intrinsic Package Fingerprints and Inexpensive Cameras. In Srdjan Capkun, Franziska Roesner, editors, 29th USENIX Security Symposium, USENIX Security 2020, August 12-14, 2020. pages 1255-1272, USENIX Association, 2020. [doi]

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