Siva Nishok Dhanuskodi, Xiang Li, Daniel E. Holcomb. COUNTERFOIL: Verifying Provenance of Integrated Circuits using Intrinsic Package Fingerprints and Inexpensive Cameras. In Srdjan Capkun, Franziska Roesner, editors, 29th USENIX Security Symposium, USENIX Security 2020, August 12-14, 2020. pages 1255-1272, USENIX Association, 2020. [doi]
@inproceedings{DhanuskodiLH20, title = {COUNTERFOIL: Verifying Provenance of Integrated Circuits using Intrinsic Package Fingerprints and Inexpensive Cameras}, author = {Siva Nishok Dhanuskodi and Xiang Li and Daniel E. Holcomb}, year = {2020}, url = {https://www.usenix.org/conference/usenixsecurity20/presentation/dhanuskodi}, researchr = {https://researchr.org/publication/DhanuskodiLH20}, cites = {0}, citedby = {0}, pages = {1255-1272}, booktitle = {29th USENIX Security Symposium, USENIX Security 2020, August 12-14, 2020}, editor = {Srdjan Capkun and Franziska Roesner}, publisher = {USENIX Association}, isbn = {978-1-939133-17-5}, }