Nguyen Ngoc Diep, Cuong Pham, Tu Minh Phuong. SigVer3D: Accelerometer Based Verification of 3-D Signatures on Mobile Devices. In Viet Ha Nguyen, Anh-Cuong Le, Van-Nam Huynh, editors, Knowledge and Systems Engineering - Proceedings of the Sixth International Conference KSE 2014, Hanoi, Vietnam, 9-11 October 2014. Volume 326 of Advances in Intelligent Systems and Computing, pages 353-365, Springer, 2014. [doi]
@inproceedings{DiepPP14, title = {SigVer3D: Accelerometer Based Verification of 3-D Signatures on Mobile Devices}, author = {Nguyen Ngoc Diep and Cuong Pham and Tu Minh Phuong}, year = {2014}, doi = {10.1007/978-3-319-11680-8_28}, url = {http://dx.doi.org/10.1007/978-3-319-11680-8_28}, researchr = {https://researchr.org/publication/DiepPP14}, cites = {0}, citedby = {0}, pages = {353-365}, booktitle = {Knowledge and Systems Engineering - Proceedings of the Sixth International Conference KSE 2014, Hanoi, Vietnam, 9-11 October 2014}, editor = {Viet Ha Nguyen and Anh-Cuong Le and Van-Nam Huynh}, volume = {326}, series = {Advances in Intelligent Systems and Computing}, publisher = {Springer}, isbn = {978-3-319-11679-2}, }