Nguyen Ngoc Diep, Cuong Pham, Tu Minh Phuong. SigVer3D: Accelerometer Based Verification of 3-D Signatures on Mobile Devices. In Viet Ha Nguyen, Anh-Cuong Le, Van-Nam Huynh, editors, Knowledge and Systems Engineering - Proceedings of the Sixth International Conference KSE 2014, Hanoi, Vietnam, 9-11 October 2014. Volume 326 of Advances in Intelligent Systems and Computing, pages 353-365, Springer, 2014. [doi]
Abstract is missing.