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B. Dimcic, Riet Labie, J. De Messemaeker, Kris Vanstreels, K. Croes, Bert Verlinden, Ingrid De Wolf. 3Sn phase in the bump and thin film Cu/Sn structures. Microelectronics Reliability, 52(9-10):1971-1974, 2012. [doi]
Abstract is missing.